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US Patent Issued to Intel on April 14 for "Integration of glass core into electronic substrates for fine pitch die tiling" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,744, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Integration of glass core into electronic substrates for fine... Read More


US Patent Issued to Intel on April 14 for "Integration of glass core into electronic substrates for fine pitch die tiling" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,744, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Integration of glass core into electronic substrates for fine... Read More


US Patent Issued to FORMITEK ELECTRIC (ZHOUSHAN) on April 14 for "Switching power device and parallel connection structure thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,745, issued on April 14, was assigned to FORMITEK ELECTRIC (ZHOUSHAN) Co. LTD. (Zhoushan City, China). "Switching power device and paralle... Read More


US Patent Issued to FORMITEK ELECTRIC (ZHOUSHAN) on April 14 for "Switching power device and parallel connection structure thereof" (Chinese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,745, issued on April 14, was assigned to FORMITEK ELECTRIC (ZHOUSHAN) Co. LTD. (Zhoushan City, China). "Switching power device and paralle... Read More


US Patent Issued to Renesas Electronics on April 14 for "Method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,746, issued on April 14, was assigned to Renesas Electronics Corp. (Tokyo). "Method of manufacturing semiconductor device" was invented by... Read More


US Patent Issued to Renesas Electronics on April 14 for "Method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,746, issued on April 14, was assigned to Renesas Electronics Corp. (Tokyo). "Method of manufacturing semiconductor device" was invented by... Read More


US Patent Issued to Intel on April 14 for "Opossum redistribution frame for configurable memory devices" (Malaysian Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,747, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Opossum redistribution frame for configurable memory devices"... Read More


US Patent Issued to Intel on April 14 for "Opossum redistribution frame for configurable memory devices" (Malaysian Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,747, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Opossum redistribution frame for configurable memory devices"... Read More


US Patent Issued to Intel on April 14 for "Capacitor pads and methods of manufacturing the same" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,748, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Capacitor pads and methods of manufacturing the same" was inv... Read More


US Patent Issued to Intel on April 14 for "Capacitor pads and methods of manufacturing the same" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,748, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Capacitor pads and methods of manufacturing the same" was inv... Read More